Terms of use. GlobalFoundries has had a rough few years. Now, GlobalFoundries is taking another shot at building out its own custom process technology, with an announcement that it intends to skip the 10nm node entirely and bring its own 7nm product to market. Even more interesting is the fact that the company intends to execute a full node shrink at 7nm, rather than using a hybrid node. FEOL covers wafer production, lithography, etch, and deposition.

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Fab 1[ edit ] Fab 1, located in Dresden , Germany, is a , m2 plant which was transferred to GlobalFoundries on its inception: Fab 36 and Fab 38 were renamed Module 1 and Module 2, respectively. This fabrication plant was constructed by GF as a green field fab for advanced technologies. There was speculation in some quarters as to where manufacture of the Core Dies would take place. The agreement will run through and insures that Global Foundries will have work for its Malta plant for that time period.

Pricing commitments for Wafers runs through when it is likely the WSA will be amended again. The facility will be transferred over within three years. In January GlobalFoundries announced that it had agreed to sell its Fab 3E in Singapore to Vanguard International Semiconductor with transfer of ownership set to be completed on December 31, Fab 6[ edit ] Fab 6, located in Woodlands, Singapore.

The site also hosted a captive mask shop , with development efforts down to the 7 nanometer node, until it was sold to Toppan in The deal closed on July 1,


12LP 12nm FinFET Technology

The features are designed to deliver better scalability and performance for applications in high-growth markets such as hyperscale datacenters and autonomous vehicles. The new platform features will improve power, performance and scalability by delivering transistor enhancements optimized for ultra-high performance and enhanced RF connectivity, as well as new high-speed, high-density memories for emerging enterprise and cloud security needs. Bami Bastani , senior vice president of business units at GF. The feature-rich enhancements being added to the platform include: Ultra-high density: Delivers increased transistor density through continued improvements to the 12LP design library 7. Embedded memory: Offers ultra-high security, one-time programmable OTP and multi-time programmable MTP embedded non-volatile eNVM memory for emerging enterprise, cloud and communication applications. Using physically undetectable charge-trapping technology CTT enables security solutions including "physically unclonable device" capabilities and efficient non-volatile memories for higher levels of SoC integration. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe.


GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow’s Intelligent Systems


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